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Intel Core i3-4170T Price in Malaysia

Compare Prices of Intel Core i3-4170T

Best price for Intel Core i3-4170T in Malaysia is RM 483.00

You can buy the Intel Core i3-4170T at the lowest price of RM 483.00 from Lazada.
Alternatively, the Intel Core i3-4170T is also sold in Indonesia at Alfacart with the price of RM 2,437.00 and Philippines at Lazada with the price of RM 518.00 and Singapore at Lazada with the price of RM 527.00.
Pricing details were last updated at 15 June 2018, 22:40.

Price List by Country for Intel Core i3-4170T

Country International Price Price in MYR
Indonesia IDR 8.500.000 MYR 2,437.00
Malaysia MYR 483.00 MYR 483.00
Philippines PHP 6,927.00 MYR 518.00
Singapore SGD 178.00 MYR 527.00

Specs of Intel Core i3-4170T

Release Date in Malaysia
ModelIntel® Core™ i3-4170T Processor (3M Cache, 3.20 GHz)
DateMar 2015
Processor
Processor family4th gen Intel® Core™ i3
Processor frequency3.2 GHz
Processor cores2
Processor socketLGA 1150 (Socket H3)
Component forPC
Processor lithography22 nm
Box
Processor modeli3-4170T
Processor threads4
System bus rate5 GT/s
Processor operating modes64-bit
Processor seriesIntel Core i3-4100 Desktop series
Processor cache3 MB
Processor cache typeL3
Compatible chipsetsIntel B85, Intel H81, Intel H87, Intel H97, Intel Q85, Intel Q87, Intel Z87, Intel Z97
SteppingC0
Bus typeDMI2
Processor codenameHaswell
Memory
Memory channels supported by processorDual
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM,DDR3L-SDRAM
Memory clock speeds supported by processor1333,1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
ECC supported by processor
Memory voltage supported by processor1.5 V
Graphics
On-board graphics adapter
On-board graphics adapter modelIntel® HD Graphics 4400
Maximum on-board graphics adapter memory16 GB
On-board graphics adapter base frequency200 MHz
On-board graphics adapter dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
On-board graphics adapter DirectX version11.1
Features
Thermal Design Power (TDP)35 W
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Maximum number of PCI Express lanes16
PCI Express slots version3.0
PCI Express configurations1x16,2x8,1x8+2x4
Supported instruction setsAVX 2.0,SSE4.1,SSE4.2
Processor package size37.5
Processor codeSR1TC
Scalability1S
CPU configuration (max)1
Embedded options available
Graphics & IMC lithography22 nm
Thermal solution specificationPCG 2013A
On-board graphics adapter ID0x41E
Processor ARK ID81209

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