The Mobile World Congress (a.k.a MWC) 2018, one of the biggest events in the mobile industry has just recently ended last Friday in Barcelona. As we look back at the festivities, MWC this year felt a little underwhelming, probably because Samsung stole the show before the event even officially began with the launch of the Galaxy S9. Nevertheless, the show still had its fair share of highlights that is worth talking about. Hence, below are some of the most notable handsets that were seen last week.
The Mobile World Congress (a.k.a MWC) 2018, one of the biggest events in the mobile industry has just recently ended last Friday in Barcelona. As we look back at the festivities, MWC this year felt a little underwhelming, probably because Samsung stole the show before the event even officially began with the launch of the Galaxy S9. Nevertheless, the show still had its fair share of highlights that is worth talking about. Hence, below are some of the most notable handsets that were seen last week.
| Release Date in Malaysia | |
|---|---|
| Model | PRIME H270M-PLUS |
| Date | Dec 2016 |
| Processor | |
| Processor manufacturer | Intel |
| Compatible processor series | Intel® Celeron®, Intel® Pentium® |
| Processor socket | LGA 1151 (Socket H4) |
| Memory | |
| Supported memory types | DDR4-SDRAM |
| Memory slots type | DIMM |
| Supported memory clock speeds | 2133,2400 MHz |
| Number of memory slots | 4 |
| Memory channels | Dual |
| Non-ECC | Yes |
| Maximum internal memory | 64 GB |
| Unbuffered memory | Yes |
| Weight & dimensions | |
| Width | 243.8 mm |
| Depth | 238.8 mm |
| Internal I/O | |
| USB 2.0 connectors | 2 |
| USB 3.0 (3.1 Gen 1) connectors | 2 |
| Number of SATA III connectors | 4 |
| S/PDIF out connector | Yes |
| Front panel audio connector | Yes |
| Number of EATX power connectors | 1 |
| CPU fan connector | Yes |
| Number of chassis fan connectors | 2 |
| Number of COM connectors | 1 |
| TPM connector | Yes |
| Back panel I/O ports | |
| USB 2.0 ports quantity | 2 |
| USB 3.0 (3.1 Gen 1) Type-A ports quantity | 2 |
| USB 3.0 (3.1 Gen 1) Type-C ports quantity | 1 |
| Ethernet LAN (RJ-45) ports | 1 |
| PS/2 ports quantity | 2 |
| VGA (D-Sub) ports quantity | 1 |
| HDMI ports quantity | 1 |
| DVI-D ports quantity | 1 |
| BIOS | |
| BIOS type | UEFI AMI |
| BIOS memory size | 128 MB |
| ACPI version | 6.0 |
| Clear CMOS jumper | Yes |
| Features | |
| Component for | PC |
| Motherboard chipset family | Intel |
| Motherboard chipset | Intel® H270 |
| Motherboard form factor | micro ATX |
| Audio output channels | 7.1 channels |
| Audio chip | Realtek ALC887 |
| Windows operating systems supported | Windows 10 Education,Windows 10 Education x64,Windows 10 Enterprise,Windows 10 Enterprise x64,Windows 10 Home,Windows 10 Home x64,Windows 10 Pro,Windows 10 Pro x64,Windows 7 Enterprise,Windows 7 Enterprise x64,Windows 7 Home Basic,Windows 7 Home Basic x64,Windows 7 Home Premium,Windows 7 Home Premium x64,Windows 7 Professional,Windows 7 Professional x64,Windows 7 Starter,Windows 7 Starter x64,Windows 7 Ultimate,Windows 7 Ultimate x64,Windows 8,Windows 8 Enterprise,Windows 8 Enterprise x64,Windows 8 Pro,Windows 8 Pro x64,Windows 8 x64,Windows 8.1,Windows 8.1 Enterprise,Windows 8.1 Enterprise x64,Windows 8.1 Pro,Windows 8.1 Pro x64,Windows 8.1 x64 |